semiconductor package mould(semiconductor package die)
Product Details:
| Shaping Mode | Punching Mold |
|---|---|
| Product Material | Metal |
| Place of Origin | Guangdong, China |
Detailed Product Description
semiconductor package mould,
semiconductor encapsulated mould,
semiconductor encapsulation
high precision metal stamping die
semiconductor package mould(semiconductor package die)
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Company Info
Guangzhou Zhida Plastic & Hardware Co., Ltd.
[China]
[Verified Member]
City: Guangzhou
Province/State: Guangdong
Country/Region : China
Business Type:Manufacturer
Online Postings: Products













